Item

Capability

PCB Layers

1-30 Layers

Base Material

FR4,CEM1,CEM3,Aluminum,Polymide, Rogers,Teflon

Copper Thickness

0.5-6 OZ

Impedance tolerance

±10%

Peeable Mask

Yes

Min.Line Width/spacing

3/3mil

Min.Annual Ring PTH

0.15mm

Mini drill size

0.10mm

Hole Aspect Ratio

10

Finished board thickness

0.2-5.0mm

Max Board Size

600*900mm,400*1200mm

Solder Mask Pitch

0.1mm

Outline Tolerance

±0.15mm

V-CUT Tolerance

±0.10mm

thickness Tolerance

±0.10mm

Gold Finger

5u"-50u"

Surface Finish

HASL,LF HAL,Immersion Gold,Immersion silver/Tin,  Flash Gold,OSP,Carbon ink

Special Capability

Burial/blind vias,Impedance Control,via plug, BGA,Gold Finger,High frequency,HDI

Test

Flying probe test,E-test，AOI test